The XRF2000 uses Microsoft Windows, allowing multiple tasks to be performed simultaneously. During operation it is possible to review measurements, perform spectrum analysis, and process statistics all while automatically sending the measurement data to Microsoft Excel or other QC programs.

The XRF2000 rapidly and non-destructively measures single-layer, multi-layer, and composition of alloys. Metal content in plating solutions and qualitative material analysis of alloys are also quickly determined.

Simply move the cursor to any area of the video image, click the mouse, and the stage moves the part directly under the X-ray beam. Fast, controllable parts positioning is accomplished with ease in seconds.

Instantly preview data in any of the five custom report formats. Measurement data, including statistics, X-Bar & R charts, and even a picture of the sample being measured, can be printed in a variety of layouts. Out-of-tolerance measurements are highlighted in red.

Precision laser focusing on parts provides the most consistent measurement accuracy possible and eliminates operator error.

Opening the chamber door automatically brings the stage forward for fast parts loading and unloading. Precise sample placement is also aided by a positioning laser.

Three chambers are available including the H, L, and PCB models. Optional features such as programmable stages, filters, and multiple collimators allow measurement of parts of various sizes and shapes for your specific requirements.

The X-ray beam image is displayed actual size ensuring precise positioning on small parts.

Unlike other X-ray systems, the XRF2000 generates X-rays only while taking measurements. Since the X-ray tube completely shuts off between measurements, there is no need for a mechanical shutter. Less X-ray tube use equals cooler operating temperatures and longer tube life.

Another first in X-ray design is the exclusive cooling controls which maintain consistent temperature of key system electronics. Measurement stability is further enhanced by the reduction in temperature variation.

Topographic mapping of plating thickness is easily accomplished. The resulting graphic is displayed in color or can be printed for further analysis. Stage programs include both automatic random and constant distance measurements.

The Beam Position feature aligns the X-ray beam to the camera image. This prevents measurement errors, unnecessary service calls, or instrument down time due to misalignment.

Instrument service and diagnostics are simplified by intelligent product engineering and the use of interchangeable components. XRF service, calibration, and technical support is provided by UPA Technology’s experienced staff

UPA Technology calibrates all instruments and thickness standards per ISO-17025. Thickness standards for most measurement applications are in-stock for prompt delivery and are offered at competitive prices. All thickness standards are traceable to the NIST and guaranteed accurate.

Jewelry Standards

PVC Standards